umatshini wokufaka isikhonkwane/ umatshini wokusika umatshini wokuhluba umatshini wokusika/ umatshini wokusika olungisayo

Ke ngoko siluqalisile uphuhliso "lweSizukulwana seSibini soShishino olulungelelanisiweyo",

A.nangona i-Sumitomo Wiring Systems, Ltd. sele ibonelela nge-"First Generation Press-fit Connector" kumthengi waseYurophu ukususela ngo-2004, ibenomlinganiselo wokunyamezelwa kwedayamitha ye-90ptm kuphela kwaye oku kube ngunobangela omkhulu wobunzima. ukwamkelwa kwabanye abathengi abaninzi, kubandakanywa basekhaya.
Ke ngoko siluqalisile uphuhliso lwe "Second Generation Press-fit Connector", ethe yaziqhelanisa noluhlu olubanzi lokunyamezelwa komngxuma, kulindelo lwemarike enkulu kwixa elizayo.

B.Isicelo seZiqhagamshelo zeMoto Ekusetyenzisweni konxibelelwano lwetekhnoloji yokudibanisa kwinqwelo-mafutha, kuye kwafuneka ukuba sithathele ingqalelo izinto ezithile, njengoko zidweliswe ngezantsi.
(1) UQhagamshelwano Lwexesha elide Ukuthembeka kwiimeko ezinzima zokusingqongileyo ezifunekayo kwiziqhagamshelo zemoto.
(2) Iindleko eziphantsi, ubuncinci zilingana naleyo yenkqubo yesiqhelo yokuthambisa.
(3) Ukuziqhelanisa noluhlu olubanzi lokunyamezela idiameter.
(4) Ukuthembeka koQhagamshelwano kwiindlela ezahlukeneyo zonyango lomphezulu we-PCB.
Ingxelo (4) ithetha ukuba unyango olwahlukeneyo lomphezulu, olufana ne "Immersion Plating (inkcenkce okanye isilivere)" kunye ne "Organic Solderability Preservative (OSP)" sele iphuhlisiwe kutshanje kwaye yamkelwa ukuthintela i-oxidization yemigangatho yobhedu kwi-PCB njengenye indlela ye-HASL eqhelekileyo. (Hot Air Solder Leveling) [2] .Nangona kunjalo, olu nyango lomphezulu lunokuchaphazela ukuthembeka koqhagamshelo lwe-press-fit, kuba unyango olungaphezulu kwi-PCB ludibana ngqo neetheminali.

II.IZIKHOKELO ZOKUYILWA

A. Isishwankathelo seNgcaciso

Inkcazo ye-press-fit connector esiyiphuhlisileyoishwankathelwe kwiThebhile II.
KwiTheyibhile II, "ubungakanani" buthetha ububanzi bomfowunelwa oyindoda (obubizwa ngokuba yi "Tab Size") nge-mm.
B.Ukumiselwa koMmandla woQhagamshelwano olufanelekileyoNjengenyathelo lokuqala loyilo lwetheminali yokucofa-fit, kufunekamisela uluhlu olufanelekileyo lwamandla oqhagamshelwano.
Ngenxa yale njongo, imizobo deformation iimpawu zeiitheminali kunye nemingxunya ephumelayo izotywe ngokwesicwangciso, njengoko kubonisiwekumfanekiso 2. Kuboniswa ukuba amandla oqhagamshelwano akwi-axis ethe nkqo,ngelixa ubungakanani betheminali kunye nedayamitha yomngxuma ikwii-axis ethe tyaba ngokulandelelanayo.

Imigca emibini yoguqulo lwetheminali ithetha enye yobukhulu kunye nobungakanani bobungakanani betheminali ngenxa yosasazo kwinkqubo yokwenziwa ngokulandelelanayo.

Uluhlu II Ukucaciswa kweSiqhagamshelo esiyiphuhlisiweyo

Uluhlu II Ukucaciswa kweSiqhagamshelo esiyiphuhlisiweyo
kumonakalo osezantsi kwiPCB

Kucacile ukuba i-contact force eveliswa phakathi kwee-terminals kunye ne-holes-holes inikwe ngokudibana kwemizobo emibini yee-terminals kunye ne-mingxuma kwi-Fig.
Sizimisele

(1) awona mandla aphantsi oqhagamshelwano afunekayo ukwenza uthintelo loqhagamshelwano phakathi kweetheminali kunye nangona imingxuma ibengaphantsi kwaye izinze ngakumbi phambi/emva kovavanyo lonyamezelo lokudityaniswa kobuncinane bobukhulu betheminali kunye nobuninzi bobukhulu bokuphumela kwidayamitha yomngxuma, kunye (2) nowona mandla uphezulu kwanele ukuqinisekisa ukuxhathisa ukugquma phakathi kwemingxuma ekufutshane engaphaya kwexabiso elichaziweyo (i-109Q kolu phuhliso) kulandela iimvavanyo zonyamezelo zokudityaniswa kobukhulu besiphelo sesiphelo kunye nobuncinci bedayamitha yomngxuma, apho ukuwohloka kokumelana nokufakwa kwe-insulation kubangelwe kukufuma. Ukufunxa kwindawo eyonakeleyo (delaminated) kwi-PCB.

Kula macandelo alandelayo, iindlela ezisetyenzisiweyo ukumisela ubuncinci kunye namandla oqhagamshelwano aphezulu ngokulandelanayo.


Ixesha lokuposa: Dec-07-2022