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Kwanangaphambi kokuba ukuqhutywa kwe-lead-free kube yinkxalabo, imisebenzi yesibini yokuthengisela ibonise imingeni enzima.
Ukufezekisa zombini imveliso ephezulu kunye nokudibanisa umthamo ngokubeka iitheminali zomsila we-solder kwakungasoloko kusenzeka.Oku kubaluleke ngakumbi kwishishini leemoto, apho izihlanganisi ezinkulu ezibunjiweyo zihlala zisetyenziselwa zombini amandla kunye neempawu zolawulo.Abavelisi kufuneka badibanise i-automated assembly of the connectors ngelixa benciphisa imiba ehambelana neenkqubo ze-soldering.Ukuhlangabezana nale njongo, iteknoloji ye-press-fit fit ivumela ukufakwa komatshini okhawulezayo wezikhonkwane ezizodwa okanye ezininzi ezihambelanayo kunye neeterminal ezingadingi amanyathelo alandelayo okuthengisa kunye nokubonelela ngezinga eliphezulu lokugcinwa kwamandla.
Itekhnoloji ye-Press-fit, ekwaziwa ngokuba yinto yokuphazamiseka okanye i-friction fit, ibonakalisiwe kwaye isetyenziswa ngokubanzi kushishino lweemoto kunye nonxibelelwano.Kwiimeko ezininzi, iye yaphelisa i-soldering ye-pin-intensive interconnect systems.Iyaqhubeka nokuvela ukuhlangabezana nemingeni emitsha yokuvelisa kunye nokujongana noluhlu olubanzi lweemfuno zemveliso.
Umceli mngeni ophambili ubandakanya ukufezekisa ulungelelwaniso olufanelekileyo phakathi kwamandla okufaka afunekayo kunye nesixa sokugcina (umz. amandla okurhoxisa afunekayo ukukhupha isikhonkwane).Amandla okugcina kufuneka asondele kangangoko kunokwenzeka kumandla ofakelo ukufumana ukomelela okukhulu koqhagamshelwano.I-deformation eninzi kakhulu yecandelo le-press-fit ingabangela ukunciphisa amandla aqhelekileyo phakathi kwepini ethobelayo kunye nombhobho womngxuma.Ithoba amandla okugcina kunye nokusebenza kubomi bemveliso.
I-Gas Tight Fit kunye noGcino oluPhezulu
I-YICHUAN inikezela ngezisombululo ezilungelelanisiweyo ezibonelela abathengi bethu ngokungena-solderless, okunamandla ngaphakathi, uqhagamshelo olungenagesi.Izikhonkwane zethu ezithobelayo zokucinezela ziye zavavanywa ngokucokisekileyo kuyo yonke imigangatho yoshishino.I-friction fit ye-press-fit pin inika uxhulumaniso oluqinileyo lwegesi kunye namandla aneleyo okugcina.Igcina amandla aqhelekileyo aqhelekileyo kwi-plated ngokusebenzisa umngxuma (PTH) yebhodi yesekethe eprintiweyo, kwaye iphelisa imfuno ye-soldering.Emva kokufaka iphini elithobelayo uqhagamshelo lugqitywa ngeyona ndlela isebenzayo
Njengoko icandelo le-eye-of-the-inaliti ye-press-fit lifunxa i-deformation ye-friction fit kwaye ayikhubeki iplate emngxunyeni.Yiyo loo nto kunokwenzeka ukususa i-pin-fit pin emva kwexesha ngaphandle komonakalo kwi-PCB okanye imfuno yokuphinda kusetyenzwe kwakhona.Kunokwenzeka ukususa izikhonkwane ezonakalisiweyo zokucinezela ngoncedo lwesixhobo esilula sesandla.Ivumela ukufaka i-pin entsha kwindawo endala efakwe emngxunyeni.
Indlela eqhubayo yokuya kuyilo lwetekhnoloji ye-fine-pitch surface Mount (SMT) nayo yenziwa lula ngokusebenzisa itekhnoloji yokucofa-fit pin.Njengoko isithuba phakathi koqhagamshelo sisiya sincinci, imiceli mngeni yokuthengisa iyanda kakhulu.Inkqubo iyonke kufuneka ilawulwe ngokungqongqo.Ukubekwa kwe-solder paste kufuneka kugcinwe ngaphakathi kokunyamezelana okuqinileyo ukuphepha ibhuloho okanye i-solder-balling phakathi kweepads.Le mfuneko yokunciphisa iingxabano ze-solder kunye ne-SMT kunye neemfuno ze-pin-in-paste zokudibanisa.Bahlala befuna iifayili ezinkulu ze-solder ukuqinisekisa ukomelela kwemikhosi yangaphandle yokudibanisa ngokomzimba.Izikhonkwane ezithobelayo ezilungelelanisa ucinezelo zivumela umenzi ukuba aphelise iingxaki, izixhobo ezikhethekileyo kunye neendleko ezongezelelweyo ezinxulumene neziqhagamshelo zokuthengisela kwiibhodi ezincinci ze-SMT.
Iyilwe kwaye yaPakisha ukuququzelela iNkqubo yokuZisebenzela
Zonke izikhonkwane ze-press-fit fit zibonelelwa ngokuqhubekayo kwiifomathi eziphindwe kabini njengenxalenye yomntu ngamnye okanye kwiindawo ezininzi zokudibanisa ukuze zifakwe ngoomatshini bokufaka isikhonkwane esinesantya esiphezulu.Oku kwenza ukuba itekhnoloji ye-press-fit idityaniswe ngokufanelekileyo kuyo nayiphi na i-SMT ekhoyo okanye imigca yokucubungula umngxuma.Izikhonkwane ze-Press-fit zingafakelwa ngokuzenzekelayo njengezidibanisi ezidityanisiweyo kuyo nayiphi na ipateni efunekayo, okanye zibekwe njengeziqhagamshelo zeheader ze-pin, zisikwe ngaphambili kubo nabuphi na ubude obufunekayo kunye/okanye indawo yokubala.Ngokuxhomekeke kwiimfuno zesicelo, iiheader ze-press-fit pin ziyafumaneka njenge-one-by (1 x 1, 1 x 2, njl.) okanye ezimbini-by (2 x 2, 2 x 3, njl.) ulungelelwaniso.
Ngenxa yokuba i-press-fit interconnect ehambelanayo ngokupheleleyo igqityiwe kwisinyathelo esinye, umsebenzi wokufaka ngokuzenzekelayo unokuhlanganiswa kuyo nayiphi na indawo ekuhambeni kwemveliso yonke.Ngokuqhelekileyo, inyathelo lokufakela iphini lokucofa liqhutywa ekupheleni okanye ekupheleni kwenkqubo;emva kokuba onke amacandelo e-SMT sele ebekiwe kwaye aphinde athengiswa.
Ukusebenzisa itekhnoloji ye-solderless press-fit ye-on-board interconnects ivumela zonke iinkqubo ze-SMT (ukuhlolwa kwe-solder paste, ukubekwa kwecandelo eliphezulu kunye nezantsi, ukugeleza kwakhona, njl. njl.) ukuba kuqhutywe ngokuzimeleyo ngokupheleleyo kwindibano yoqhagamshelwano.Oku kunciphisa iindleko kunye nemingeni yokudibanisa amanyathelo enkqubo enzima efana nokubekwa kweendlela ezingaqhelekanga zokudibanisa, ukukhonkxa nge-paste, i-solder yesibini kunye / okanye iinkqubo zezandla.Ukutshintsha uxhulumaniso lwe-solder kunye ne-teknoloji ye-press-fit kuya kuphucula ukuzenzekelayo kunye neenkqubo zoshishino.
Ngaphandle kokwenza lula ukuhamba kwemveliso ngokubanzi, ukufaka i-solderless interconnects njengenyathelo lokugqibela kwakhona kuthintela umngcipheko we-scrap kunye neendleko zokuphinda zenziwe kwakhona ezinokuthi zenzeke ngokuzama ukulawula iinkqubo ezinzima ze-soldering phezulu.Onke amanye amanyathelo okucubungula sele egqityiwe kwaye, emva kokufaka izikhonkwane ze-press-fit okanye iitheminali, indibano yokugqibela iyenziwa kwaye ilungele ukuvavanywa.
I-YICHUAN ibonelela ngoomatshini bokufaka iphini ngesantya esiphezulu ngokobukhulu obahlukeneyo kwiimarike kuMntla Merika, eYurophu naseAsia.
Ixesha lokuposa: Jun-03-2019