Imigca yemveliso ye-SMT: ukusebenzisa amacandelo eteknoloji ephezulu kunye nokwandisa ukusebenza kakuhle
Njengoko itekhnoloji ihambela phambili, iinkampani zizama ukukhulisa ukusebenza kakuhle kunye nokwandisa imveliso.Injongo yeli nqaku kukubonelela ngamagqabantshintshiImigca yemveliso ye-SMTkunye namacandelo abo, kunye nendlela iteknoloji yomgca wemveliso ye-SMT eqhubela phambili ngayo inokunceda ukwandisa ukusebenza kakuhle.
Amacandelo omgca wemveliso we-SMT:
Umgca wemveliso we-SMT uquka amacandelo azimeleyo asebenza ngokuhambelanayo ukuqinisekisa inkqubo yokuvelisa egudileyo.La malungu abalulekileyo aquka:
1. Umatshini we-SMT: Undoqo weUmgca wemveliso we-SMTngumatshini onoxanduva lokubeka izinto ze-elektroniki kwi-PCB.Baziwa ngokuba ngoomatshini bokukhetha nendawo, aba matshini basebenzisa iingalo zerobhothi kunye nemilomo yokufunxa ukukhetha izinto kwi-fieder kwaye bazibeke ngokuchanekileyo kwi-PCB.
2. I-oven ye-reflow: Emva kokuhlanganisana, i-PCB idlula kwi-oven yokubuyisela apho i-solder paste esetyenziselwa ukubamba amacandelo adibeneyo ayanyibilika kwaye aqiniswe, enze ibhondi eqinile.I-oven reflow iqinisekisa ukuba i-solder joints yenziwe ngokuchanekileyo kwaye amacandelo afakwe ngokukhuselekileyo kwi-PCB.
3. Umshicileli we-solder paste: Usetyenziso oluchanekileyo lwe-solder paste lubalulekile kwinkqubo ye-SMT.Umshicileli we-solder paste usebenzisa i-stencil ukufaka i-solder paste kwi-PCB, iqinisekisa ulungelelwaniso oluchanekileyo kunye neepads.
4. Inkqubo yokuhlola: Ukuze kugcinwe imigangatho yomgangatho, yonke imveliso yokuvelisa ithatha inkqubo yokuhlola.Oomatshini bokuhlola okuzenzekelayo (AOI) bajonga iziphene ezifana nezinto ezingekhoyo okanye ezingalungelelaniswanga kakuhle, iziphene zokuthengisela, kunye neziphene zePCB.Iinkqubo zokuhlola i-X-reyi zikwasetyenziselwa ukubona iziphene ezifihlakeleyo, ezinje ngokungonelanga kwamalungu e-solder.
Lo matshini usebenzela ukusika ukhokelo lwecandelo emva kokutywinwa kwePCB.SMT
Ixesha lokuposa: Oct-26-2023